Tec-Bond® 200 Series

The Tec-Bond® 200 Series of thread locking products are room-temperature curing, microencapsulated adhesives. They can be applied to male or female threaded fasteners of virtually all sizes, configurations, compositions and finishes.

Tec-Bond 200 Series contains a microencapsulated, reactive element that is suspended in a quick-curing, waterborne resin. The shearing forces caused by installation of the fastener to the mating part release the activator to allow curing of the resin matrix. The resulting chemical reaction rapidly bonds the surfaces, locking parts together and sealing leak paths. Tec-Bond 200 products offer consistent and predictable torque values, and require no heat or primers for curing.