Tec-Fil Series, Electrical Potting and Encapsulating Compound

Tec-Fil products are reactive filling compounds used in a variety of assembly operations for encapsulating, potting, and ruggedizing.

These two-component materials are available in many grades, designed for various special purposes. The most popular grades include those formulated for control modules, electronics, and electrical markets. Several grades are specifically designed for applications where Class H performance is needed.

In the final cured state, Tec-Fil products are heat-stable, with varying hardness and extreme durability. They are available in a standard opaque black color to hide proprietary electrical circuit design, but can also be made to color code your assembly for easy identification. In fact, Tec-Fil materials may be custom formulated to meet the property requirements for your specific application.