Tec-Bond® 230 Series

The Tec-Bond® 230 Series of thread locking products are room-temperature curing, microencapsulated adhesives. They can be applied to male or female threaded fasteners of virtually all sizes, configurations, compositions and finishes.

Tec-Bond 230 Series products contain microencapsulated reactive elements that are suspended in a quick-curing resin, carried in a solvent or water medium (dependent on formula).

The shearing forces caused by installation of the fastener to the mating part release reactive compounds that cure into a tough, well-bonded polymer. The resulting matrix rapidly bonds the surfaces, semi-permanently locking parts together and sealing leak paths.

Tec-Bond 230 Series products offer consistent and predictable torque values, and require no heat primers for curing.