The Tec-Fil™ 1800 Series is a family of two-part reactive filling compounds engineered for encapsulation, potting, ruggedizing, and protection of electronic and electrical assemblies. Available in multiple grades and cure profiles, the series provides reliable mechanical support, environmental protection, and long-term durability for demanding industrial applications. Other grades are available for metal jointing and construction/concrete repair.
The Tec-Fil™ 1800 Series consists of two-part reactive filling compounds developed for encapsulation, potting, ruggedizing, binding, sealing, and component protection across a broad range of electronic and electrical assemblies. Designed for both production and specialty applications, the series includes multiple grades with varying cure characteristics, hardness, viscosity, and processing properties to meet specific engineering requirements.
Applied as a two-component system, the material cures to form a durable, heat-stable protective mass that securely encapsulates components, fills voids, and improves resistance to vibration, moisture, chemicals, and mechanical stress. Select grades are formulated for demanding electrical applications, including transformer encapsulation and Class H thermal performance.
Available in standard clear/straw, amber, black, and custom colors, Tec-Fil™ 1800 Series compounds can also be formulated to meet specific performance requirements, including cure schedule, hardness, shrinkage, viscosity, and other application-specific properties.
Chemistry: Two-part reactive filling compound
Mix Ratio: Grade dependent
Cure Method: Room-temperature cure and/or elevated-temperature cure (depending on grade)
Gel Time: Grade dependent
Hardness: Available in multiple Shore hardness ranges
Viscosity: Available in multiple viscosities to suit various dispensing and encapsulation requirements
Colors: Clear/Straw, Amber, Black, and custom colors
Shelf Life: Grade dependent
Customization: Available in multiple formulations with customizable cure profile, hardness, viscosity, shrinkage, and color
Performance, Advantages and Benefits
Comprehensive Component Protection: Forms a durable protective barrier around electronic and electrical components, helping prevent damage from moisture, contaminants, vibration, and mechanical impact.
Multiple Grades for Engineering Flexibility: Available in a wide range of formulations to meet varying application requirements, including viscosity, hardness, cure schedule, color, shrinkage, and thermal performance.
Reliable Thermal Performance: Selected grades are designed for demanding thermal environments, including applications requiring Class H performance and long-term heat stability.
Efficient Manufacturing: Supports production processes with multiple cure profiles, allowing manufacturers to select formulations that best match assembly requirements and production throughput.
Excellent Mechanical Durability: Cures into a tough, durable material that provides structural support, resists cracking, and protects assemblies from vibration and mechanical stress.
Custom Formulation Capability: Tec-Fil™ 1800 Series compounds can be custom engineered to satisfy specific electrical, mechanical, thermal, or manufacturing requirements for specialized applications.
What is the Tec-Fil™ 1800 Series used for?
The Tec-Fil™ 1800 Series is used for encapsulation, potting, ruggedizing, and protection of electronic and electrical assemblies, including transformers, control modules, sensors, and PCB assemblies.
Are all Tec-Fil™ 1800 Series products the same?
No. The series includes multiple grades designed for different performance and processing requirements. Formulations vary in viscosity, hardness, cure profile, thermal capability, and other properties.
Do all grades use the same mix ratio?
Mix ratio varies depending on the specific grade. Please refer to the appropriate Technical Data Sheet for product-specific processing information.
Can Tec-Fil™ 1800 Series be customized?
Yes. Custom formulations are available to meet specific requirements such as cure schedule, viscosity, hardness, shrinkage, color, and application performance.
What colors are available?
Standard formulations are available in clear/straw, amber, and black. Custom colors are also available for assembly identification and product differentiation.
Are these materials suitable for high-temperatureapplications?
Yes. Selected grades are formulated for demanding thermal environments, including applications requiring Class H thermal performance.
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