Tec-Fil™

Tec-Fil™ products are reactive filling compounds used in a variety of assembly operations for encapsulating, potting, ruggedizing, binding, repair and sealing.

• Tec-Fil products are strong and long lasting once fully cured.
• These products may be formulated to meet a wide range of requirements for color, cure time, hardness, shrinkage, and/or other properties.
• Can be used for applications such as microelectronics or PCB assembly, wire tacking, lamination, ruggedizing, potting, or encapsulating electronic components. Other grades are available for metal jointing and construction/concrete repair.