Tec-Fil™ Reactive Filling Compound
Tec-Fil™ products are reactive filling compounds used in a variety of assembly operations for encapsulating, potting, ruggedizing, binding, repair and sealing.
- Tec-Fil products are strong and long lasting once fully cured.
- These products may be formulated to meet a wide range of requirements for color, cure time, hardness, shrinkage, and/or other properties.
- Can be used for applications such as microelectronics or PCB assembly, wire tacking, lamination, ruggedizing, potting, or encapsulating electronic components. Other grades are available for metal jointing and construction/concrete repair.
DESCRIPTION:
Tec-Fil products are reactive filling compounds used in a variety of assembly operations for encapsulating, potting, and ruggedizing.
These two-component materials are available in many grades, designed for various special purposes. The most popular grades include those formulated for control modules, electronics, and electrical markets. Several grades are specifically designed for applications where Class H performance is needed.
In the final cured state, Tec-Fil products are heat-stable, with varying hardness and extreme durability. They are available in a standard opaque black color to hide proprietary electrical circuit design, but can also be made to color code your assembly for easy identification. In fact, Tec-Fil materials may be custom formulated to meet the property requirements for your specific application.
PRODUCT FEATURES:
» Durable: Tec-Fil products are strong and long lasting once fully cured.
» Customizable: These products may be formulated to meet a wide range of requirements for color, cure time, hardness, shrinkage, and/or other properties.
» Inexpensive: Compared to competing products, these reactive filling compounds are low-cost.
» Multiple Applications: Can be used for applications such as microelectronics or PCB assembly, wire tacking, lamination, ruggedizing, potting, or encapsulating electronic components.