Tec-Bond® 235 secures threaded fasteners to prevent loosening caused by vibration, dynamic loads, and fluid exposure across a wide range of manufacturing and assembly environments. A room-temperature curing, pre-applied thread adhesive available in solvent-based and dry-concentrate grades, engineered for consistent and predictable torque performance across production volumes.
Tec-Bond® 235 is a microencapsulated pre-applied thread adhesive that delivers reliable locking performance on male or female threaded fasteners of virtually all sizes, configurations, compositions, and finishes. Its microencapsulated reactive elements remain dormant in a quick-curing resin until fastener installation, requiring no heat or primers for cure activation.
The shearing forces generated during fastener installation rupture the microcapsules, releasing reactive compounds that cure into a tough, well-bonded polymer matrix. This matrix rapidly bonds mating surfaces, semi-permanently locking the joint and sealing leak paths.
Tec-Bond® 235 may be used as a direct replacement for 3M™Fastener Adhesive 2353, which has been discontinued. Read more here.
For a water-based, REACH and RoHS compliant alternative, see Tec-Bond®240
Installation Torque: <10 in/lbs.
Break/Prevail Torque After Full Cure: 225/250 in/lbs. 25/28 Nm
Temperature Range: -65/300 °F -54/150°C
Fixture Time: >90 min
Standard Color: Sapphire
Specialty Colors: Yellow, Red, Green
On-Part Life: 4 years
Full Cure Time At Room Temperature: 72 hrs
Performance, Advantages and Benefits
What is the difference between Tec-Bond® 235-IN and 235-PR?
The Industrial Grade (235-IN) is suited for general-purpose fastener locking on standard metal substrates. The Precision Grade (235-PR) was developed for precision assemblies where physical properties are tightly controlled and microcapsule character is specifically engineered.
What is the difference between Tec-Bond 235 solvent-based and Tec-Bond 235 DPC?
Tec-Bond 235 is the standard solvent-based formula. Tec-Bond 235 DPC (Dry Powder Concentrate) has the solvent removed, improving transport efficiency and extending bulk shelf life from 1 year to 3 years, while delivering equivalent on-part performance.
Does Tec-Bond® 235 require primer or heat to cure?
No. Tec-Bond® 235 is a room-temperature curing adhesive that requires neither heat nor primers for activation. Cure is initiated by the shearing forces generated during fastener installation.
Is there a water-based alternative to Tec-Bond® 235?
Yes. Tec-Bond® 240 is the direct water-based, REACH and RoHS compliant alternative toTec-Bond® 235, delivering equivalent locking performance with solvent-free chemistry.